Thermal recording medium
US5246766A · kind A · utility
1Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1990 |
| Grant date | Sep 21, 1993 |
| Priority date | — |
| Expiry date | Aug 10, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31612
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal recording medium including a base layer containing a resin having a functional group which chemically bonds with a metal having a low melting point, such as Sn-Pb alloy, and a thermal recording layer made of a thin film with low resistivity of a low melting point metal formed on said base layer such that when a part of the thermal recording layer is heated, the heated part melts and perforates to record information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.