Bonding, sealing and adhesive composition based on silicone
US5246974A · kind A · utility
5Cited by
14References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1992 |
| Grant date | Sep 21, 1993 |
| Priority date | — |
| Expiry date | Jun 19, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0247
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A foamable, curable composition or mass based on silicone is disclosed which comprises components which expand at higher temperatures and which do not burn or are difficult to burn. The mass is suitable for fire-proofing, since the burning temperature leads to an expansion of these components. The mass can be used to seal or cover objects which are in danger of burning or can be formed into a finished, molded object or body and used as such.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.