Patent · US Expired

Thermoplastic molding material based on polyoxymethylene and polyamide

US5247022A · kind A · utility

4Cited by

4References

3Claims

0Family size

Assignee

BASF SE

Inventors

Graham E. McKee · Ludwigshafen, DE
Walter Goetz · Ludwigshafen, DE
Siegbert Bohnet · Mannheim, DE
Hartmut Zeiner · Plankstadt, DE

Key dates

Filing date	Sep 24, 1991
Grant date	Sep 21, 1993
Priority date	—
Expiry date	Sep 24, 2011

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L63/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A thermoplastic molding material based on PA0 A) from 2 to 97.5% w/w of a homopolymer or copolymer of polyoxymethylene PA0 B) from 2 to 97.5% w/w of a polyamide PA0 C) from 0.5 to 25% w/w of a polycondensate of 2,2-di(4-hydroxyphenyl)propane and epichlorohydrin PA0 D) from 0 to 60% w/w of an impact modifier, and PA0 E) from 0 to 60% w/w of fibrous or particulate fillers or mixtures thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.