Patent · US Expired

Apparatus and method for monitoring laser material processing

US5247155A · kind A · utility

38Cited by
4References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 7, 1991
Grant dateSep 21, 1993
Priority date
Expiry dateAug 7, 2011

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K26/03
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Apparatus and method for monitoring laser materials processing, such as laser welding and laser drilling, wherein an indication of the quality of the processing is obtained by monitoring the plasma generated spaced charge distribution near the melt pool. A metal electrode, or electrodes, is disposed near the melt pool but not in contact with the workpiece, nor necessarily in contact with the hot plasma. The electric charge distribution (one dimensional or multi-dimensional) is monitored between the electrode or electrodes and the workpiece or between the electrodes themselves. The existing laser processing nozzle (insulated from the workpiece) can be used for this purpose, multi-probes such as a quadrant nozzle, can identify the focused laser beam position in real time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.