Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

US5248519A · kind A · utility

Assignee

• The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · US

Inventors

• Diane M. Stoakley · Yorktown, US
• Anne K. St. Clair · Poquoson, US

Key dates

• Filing date: Jul 26, 1991
• Grant date: Sep 28, 1993
• Expiry date: Jul 26, 2011

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B05D2505/50
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of this additive are: Ho(OOCCH.sub.3).sub.3, Er(NPPA).sub.3, TmCl.sub.3, and Er(C.sub.5 H.sub.7 O.sub.2).sub.3. The soluble polyimide resin is combined with the article to form the assembly.