Process for electroless plating tin, lead or tin-lead alloy
US5248527A · kind A · utility
267Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1992 |
| Grant date | Sep 28, 1993 |
| Priority date | — |
| Expiry date | Feb 28, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a process for electroless plating tin, lead or tin-lead alloy on copper or copper alloy using an electroless plating bath containing a water soluble tin and/or lead salt, an acid capable of dissolving the salts, and a complexing agent. The tin and/or lead content in the bath is maintained high enough to chemically deposit thick films by replenishing the tin and/or lead salt in proportion to an increase in concentration of copper ion dissolving out in the bath. Also provided is an electroless tin, lead or tin-lead alloy plating process in which a water soluble copper salt is added to a fresh bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.