Bonded structure of aluminum alloy pressed plate
US5248559A · kind A · utility
10Cited by
2References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 10, 1991 |
| Grant date | Sep 28, 1993 |
| Priority date | — |
| Expiry date | May 10, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A bonded structure of an Al alloy pressed plate, in which another member is bonded onto the surface of the Al alloy pressed plate that has a lubricant layer by use of an epoxy resin based adhesive. The adhesive contains an epoxy resin, a dehydrated phosphate and a latent curing agent. The epoxy resin comprises a polyester type epoxy resin and at least one resin selected from the group consisting of a bisphenol epoxy resin, a rubber-modified bisphenol epoxy resin, and a urethane-modified epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.