Toughened resin systems for composite applications
US5248711A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1989 |
| Grant date | Sep 28, 1993 |
| Priority date | — |
| Expiry date | Feb 16, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/928
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermosetting resins for use in high performance fiber-reinforced composites are toughened without compromising their processability by the inclusion of micron-sized particles of thermoplastic material which are solid at ambient temperatures but solubilize in the resins at a temperature below the gel temperature of the thermosetting resin. By appropriate selection of the solubilization temperature (or temperature range) of the thermoplastic material, one achieves a composite product having intralaminar or interlaminar toughness emphasized or a combination of both. The invention is of particular utility when applied to bismaleimide resin systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.