Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates
US5248739A · kind A · utility
118Cited by
10References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1992 |
| Grant date | Sep 28, 1993 |
| Priority date | — |
| Expiry date | Oct 14, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.