Award recognition package
US5249670A · kind A · utility
21Cited by
12References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 1992 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Mar 11, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D5/4204
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The award recognition package is formed from an originally flat diecut blank of paper stock. The blank is diecut so as to form a rectangular base section with four sides, with four flaps extending from each of the four sides of the base section. Each flap has a pair of bend scores so that as each flap is folded up and over onto the base section the award recognition package is formed into a thin box which displays the award recognition pin, tack, medallion or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.