Thermal coupling with water-washable thermally conductive grease
US5250209A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1992 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Apr 15, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2020/01
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic alkylene oxide modified silicone carrier, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an antioxidant and an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.