Conductive polymer composition
US5250228A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1991 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Nov 6, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C7/027
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.