Mechanically enhanced, high impact strength triazine resins, and method of preparing same
US5250347A · kind A · utility
3Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1992 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Mar 10, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.