Curable adhesive composition
US5250591A · kind A · utility
16Cited by
23References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1991 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Jun 19, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable adhesive composition is disclosed, comprising a polymerizable prepolymer, a reactive diluent, and a polymerization initiator, wherein said composition further comprises an inorganic filler and/or a (meth)acrylate having an isocyanurate ring. The adhesive composition of the invention is curable by the action of heat or light and is extremely useful as an adhesive for surface mounting devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.