Method and device for cutting a multilayer assembly composed of a plurality of thin films and comprising a thin film electrochemical generator or a component part thereof
US5250784A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 24, 1991 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Oct 24, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
At least one laser beam is focused on one side of an assembly to be cut at a point on the side which is part of the cutting profile and which is called the point of impact of the beam on side side, in order to cause at that point a disintegration of the material of the assembly. The laser beam is moved in relation to the assembly so that the impact point describes a trajectory which corresponds to the desired cutting profile, while maintaining a controlled atmosphere in the area around the impact point. Uses particularly include cutting solid polymer electrolyte lithium thin film electrochemical generators, or cutting precursors of such generators.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.