Ultra-thin surface mount crystal package
US5250870A · kind A · utility
33Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1992 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Mar 25, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1014
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An ultra thin piezoelectric quartz crystal package can be realized by using adhesive dollops to compliantly mount a piezoelectric device within a thin package. The adhesive dollops maintain spacing between the upper and lower surfaces of the piezoelectric device (18) and the surfaces (13 and 15) of the housing that is comprised of upper and lower substrates (12 and 14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.