Wire bonding method and apparatus
US5251805A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 28, 1991 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Aug 28, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.