Flexible coverstock semi-rigid foam void test mold
US5251866A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1991 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Oct 21, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S249/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A test mold assembly for evaluating the surface deformation tendency of a coverstock bonded to a reactive plastic formulation to voids in the formulation including a base adapted to support a coverstock and spaced side walls extending upwardly from the base to define a mold cavity for receiving foam precursors. The assembly further includes a lid adapted to form the top of the mold cavity and having a cover portion disposed spaced from the base. The lid includes a plurality of integral projections extending downwardly from the cover portion into the mold cavity a predetermined distance to create voids in the foam. A method of making a foam void model for evaluating the surface deformation tendency of a coverstock bonded to a reactive plastic formulation to voids in the formulation is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.