Carrier sheet for printed circuits and semiconductor chips
US5252383A · kind A · utility
26Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1992 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Jun 29, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier sheet for printed circuits and semiconductor chips having enhanced adhesion of conductive metal layers to a fluororesin surface resulting from rendering the fluororesin surface hydrophilic by a hydrophilic macromolecule before plating the metal onto the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.