Positive photoresist compositions
US5252427A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1992 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Jul 21, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/039
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides an aqueous-processable, positive-working photoresist composition having improved photospeed and aqueous development rate without substantially reducing processing latitude in printed circuit chemistries. The compositions contain (a) a polymeric material having a polymer backbone with pendant acid labile groups which are bound directly or indirectly to the polymer backbone, and free acid groups, wherein the polymeric material has an acid number of about 25 and is substantially insoluble in 1% by weight aqueous sodium carbonate solution at 30.degree. C., and (b) a substance that forms an acid upon exposure to actinic radiation. The positive photoresists of this invention may be used to prepare printed circuits wherein the photoresist may be applied to the printed circuit substrate as a liquid coating, as a solid, dry film or from an electrodeposition bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.