Patent · US Expired

Thermoplastic moulding materials based on polyphenylene ethers and polyamides

US5252647A · kind A · utility

0Cited by

11References

10Claims

0Family size

Assignee

Huels Aktiengesellschaft · DE

Inventors

Joachim Mugge · Haltern, DE
Udo Kowalczik · Bochum, DE
Friedrich Georg Schmidt · Haltern am See, DE

Key dates

Filing date	Nov 18, 1991
Grant date	Oct 12, 1993
Priority date	—
Expiry date	Nov 18, 2011

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L69/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A thermoplastic moulding material is prepared by the admixture of PA1 a) 3 to 80 parts by weight of polyphenylene ethers, PA1 b) 20 to 97 parts by weight of polyamides, PA1 c) 0.1 to 10 parts by weight of carbonates of the general formula ##STR1## in which X and Y independently of one another denote an alkyl, cycloalkyl, aryl or substituted aryl radical, each having up to 12 C atoms, PA1 d) 0 to 30 parts by weight of impact modifiers and PA1 e) 0 to 75 parts by weight of further polymers, if necessary.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.