Apparatus for contouring a semiconductor, light responsive array with a prescribed physical profile
US5252850A · kind A · utility
8Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 27, 1992 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Jan 27, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Large area semiconductor wafers such as CCDs typically have a non-flat profile. A vacuum chuck is used to generate a vacuum under the chip to reduce the curvature to conform to the flat profile of the substrate surface through which the vacuum is generated. Other than flat final profiles are useful also.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.