Semiconductor device having flip chip bonding pads matched with pin photodiodes in a symmetrical layout configuration
US5252852A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1992 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Dec 11, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
As semiconductor device includes a substrate and first and second semiconductor light receiving elements which are spaced apart and monolithically integrated on the substrate. The light receiving elements each has first and second terminals. A first flip-chip bonding pad is formed on the surface of the device and the device includes a first conductor element which electrically interconnects the first terminals of the elements in series and includes a centrally disposed portion that is electrically connected to the first flip-chip bonding pad. Second and third flip-chip bonding pads are also formed on a surface of the device and elongated electrodes are provided for electrically interconnecting the second terminal of the first light receiving element with the second flip-chip bonding pad and the second terminal of the second light receiving element with the third flip-chip bonding pad. The elongated electrodes have essentially the same length so as to stabilize the optical and electrical balance characteristics of the device and provide a satisfactory dual balance optical receiver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.