Semiconductor device having stacked lead structure
US5252854A · kind A · utility
44Cited by
3References
44Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 18, 1991 |
| Grant date | Oct 12, 1993 |
| Priority date | — |
| Expiry date | Jun 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a resin-molded type semiconductor device having a thin package while avoiding short-circuit of wires with a common inner lead. In the construction thereof, a common inner lead constituted by a thin metal sheet is fixed onto a circuit-forming surface of a rectangular semiconductor chip substantially in parallel with longer sides of the chip and substantially in a central region of the chip, and a plurality of inner leads for signals, which are in the form of a frame, are stacked and fixed onto the common inner lead; then these components are molded with resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.