Sputtering apparatus
US5254236A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Oct 19, 1993 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a sputtering apparatus comprising a film-deposition chamber having a gas-supplying pipe connected thereto, for depositing a film on the surface of a substrate to be processed, a target provided in the film-deposition chamber, a mask having an opening portion and a masking portion, the mask being provided opposing to the target in the film-deposition chamber, and holding means for holding the substrate against the mask in such a manner that the film-depositing surface of the substrate is in close contact with the mask, the improvement according to the present invention comprises a mask having exhaust passages formed in the masking portion thereof, each of exhaust passages having one end exposed to the inside of the film-deposition chamber and the other end exposed to the outside of the film-deposition chamber, the one end of each of the exhaust passages and the other end thereof being communicated with each other, but not seen through each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.