Hybrid microchip bonding article
US5254811A · kind A · utility
22Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1991 |
| Grant date | Oct 19, 1993 |
| Priority date | — |
| Expiry date | May 16, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An article for tape-automated bonding of integrated circuit microchips comprises a carrier sheet (22) carrying conductive tracks (23) with a tubular metal formation (21) passing through the sheet at the end of each track for connection to a microchip (24). The tubular formations tend to accommodate irregularities in the chip and may contain solder or other metal having a lower melting point than the tubular formation to effect bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.