Process for drying metal surfaces using gaseous hydrides to inhibit moisture adsorption and for removing adsorbed moisture from the metal surfaces
US5255445A · kind A · utility
12Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1991 |
| Grant date | Oct 26, 1993 |
| Priority date | — |
| Expiry date | Jun 6, 2011 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B21/14
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A process for drying a metal surface to enhance the stability of a gas mixture containing one or more gaseous hydrides in low concentration in contact therewith, which comprises: a) purging gas in contact with the metal surface with inert gas to remove the purged gas, b) exposing the metal surface to an amount of a drying agent comprising an effective amount of gaseous hydride of silicon, germanium, tin or lead, and for a time sufficient to dry the metal surface, and c) purging the drying agent using inert gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.