Method for solder application and reflow
US5255839A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1992 |
| Grant date | Oct 26, 1993 |
| Priority date | — |
| Expiry date | Jan 2, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0485
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for applying solder on a substrate (12) comprises the steps of providing a substrate (12) having predefined solder pads (15) and then providing solder spheres (16) for suitable placement on the solder pads. Then applying flux (14) and tacking media (18) between the solder pads (15) and the solder spheres (16) and then placing the solder spheres on the solder pads. Subsequently the solder spheres are heated onto the solder pads of the substrate providing reflowed solder (26) on the solder pads. Then a layer of flux tacking media (28) is applied on the reflowed solder. Next, a component (30 or 40) is placed on the reflowed solder and flux tacking media providing a substrate assembly (10). Finally, the circuit assembly is heated allowing the component to be soldered to the solder pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.