Plasma processing method and apparatus
US5256483A · kind A · utility
14Cited by
8References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | Oct 26, 1993 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.