Semiconductor wafer wax mounting and thinning process
US5256599A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1992 |
| Grant date | Oct 26, 1993 |
| Priority date | — |
| Expiry date | Jun 1, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wax (13) dissolved in solvent is placed on a semiconductor wafer (12) and made uniform. An assembly is formed by bonding the semiconductor wafer (12) to a submount (17) with a uniform wax layer (14). The submount (17) supports and allows handling of the semiconductor wafer (12) during wafer process steps. The assembly is heated in a vacuum to remove solvent and air trapped in the uniform wax layer (14) thereby minimizing air voids which can cause a non-uniform bond. The assembly is then annealed to reduce stress on the semiconductor wafer (12) induced by differing material thermal expansion rates of the semiconductor wafer (12), the uniform wax layer (14), and the submount (17).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.