Hot melt adhesives useful in temporary bonding operations
US5256717A · kind A · utility
70Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1990 |
| Grant date | Oct 26, 1993 |
| Priority date | — |
| Expiry date | Dec 19, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/34
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesives having suitable open time and crystallinity properties making them especially useful as temporary adhesives are provided by a composition comprising a combination of 5 to 50% by weight of an isotactic thermoplastic polybutylene copolymer or a low density ethylene polymer with 3 to 65% by weight of a solid benzoate plasticizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.