Method and apparatus for electronic component lead inspection
US5257714A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Aug 12, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0813
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method and apparatus of the present invention permit the visual inspection of electronic component leads during the mounting thereof. A hot bar thermode or other mounting tool is provided having a plurality of thermally activatable blades. A vacuum chuck and associated vacuum pump are utilized to selectively mount an integrated circuit device such that the conductive leads of the device are disposed adjacent to the lower surfaces of the thermally activatable blades. A low angle light source is then utilized to illuminate the integrated circuit device conductive leads such that a high contrast is created between the conductive leads and the lower surface of the thermally activatable blades, in order to permit an accurate visual inspection of the conductive leads. In one embodiment of the present invention, the lower surfaces of the thermally activatable blades are given a uniform grain by lapping those surfaces in a single direction to minimize the specularity of these surfaces and the angle of illumination is adjusted to enhance the contrast between the conductive leads and the lower blade surfaces. A camera disposed below the hot bar thermode may then be utilized to permit rem…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.