Method for manufacturing a semiconductor device using a circuit transfer film
US5258325A · kind A · utility
254Cited by
18References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Feb 13, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N5/7491
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.