Semiconductor device encapsulant
US5258426A · kind A · utility
18Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1990 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Feb 20, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190.degree. C., (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.