Heat curable adhesive
US5258427A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 1991 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | May 17, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J163/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an improved heat curable epoxy resin adhesive in which a metal oxide, for example zinc oxide, and a polyhydroxyaryl compound, for example gallic acid, are used in combination with an epoxy resin, for example a heat curable liquid epoxy resin adhesive, to give an adhesive composition having significantly improved binding strength and resistance to weathering. The epoxy resin adhesive composition of the invention has been found to be particularly advantageous in the bonding of metal surfaces providing higher bond strength over a prolonged period and improved resistance to the deterioration of bond strength in the presence of water or high humidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.