Molding compounds based on aromatic polyamides
US5258470A · kind A · utility
16Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | May 28, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An aromatic polyamide molding compound, comprising: PA0 I. an aromatic polyamide having the basic structure ##STR1## where Ar is an aromatic radical without amine-reactive functional groups n is a number between 5 and 500; X represents --SO.sub.2 -- or --CO--, and PA1 Y represents --O-- or --S--; and PA0 II. an aromatic liquid crystalline thermoplastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.