One-step encapsulation, air gap sealing and structure bonding of thermal ink jet printhead
US5258781A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 8, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Apr 8, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1623
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A one-step process bonds a manifold to a printhead die and interconnection board located on a heat sinking substrate, encapsulates wire bonds extending from the interconnection board and the printhead die, and seals air gaps between the manifold and printhead die. A through hole is made in the heat sink substrate and communicates with a cavity defined by the manifold. During assembly, the manifold is positioned on top of the substrate containing the printhead die and the interconnection board and retained by pins. An encapsulation fluid is injected from an underside of the substrate through the through hole and into the cavity. Injection is stopped when the fluid flows nearly to the front of the printhead. The process provides encapsulation of wire bonds, sealing of any air gap between the manifold and the printhead along a front face, and enhances structural bonding of the manifold to printhead components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.