Molded-in antenna with solderless interconnect
US5258892A · kind A · utility
34Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1992 |
| Grant date | Nov 2, 1993 |
| Priority date | — |
| Expiry date | Jan 22, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/40
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A communication device (10) includes a loop antenna (18) that is located within a molded portion of the housing (14) of the communication device, and an electrical contact (20) for the antenna that also provides a mechanical support for at least a portion of the communication device (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.