Method for forming a multilayer microelectronic wiring module
US5259110A · kind A · utility
37Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1992 |
| Grant date | Nov 9, 1993 |
| Priority date | — |
| Expiry date | Apr 3, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.