Bonder tool cleaning mechanism
US5259155A · kind A · utility
1Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 1992 |
| Grant date | Nov 9, 1993 |
| Priority date | — |
| Expiry date | May 7, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7801
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a bonder tool cleaning mechanism in a bonding machine, a coarse grindstone, a finishing grindstone and a wire brush are provided on a cleaning section, and when a bonding tool is moved above the cleaning section and then moved down to come into contact with the grindstones and brush, the cleaning section oscillates horizontally so that grindstones and brush clean the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.