Patent · US Expired

Method of manufacturing a thin-film pattern on a substrate

US5259926A · kind A · utility

253Cited by
6References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 24, 1992
Grant dateNov 9, 1993
Priority date
Expiry dateSep 24, 2012

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/942
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

Disclosed is an improvement in a thin-film pattern manufacturing method which includes the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching. According to the improvement, the mask is manufactured by forming a layer of an organic resin on the thin film on the substrate and by forming the organic resin layer in the desired pattern by a mechanical forming member. In another embodiment, the organic resin is directly formed or moulded on the thin film by a forming or moulding member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.