Patent · US Expired

High impact flameproofed polyphenylene ether-polyamide molding materials

US5260359A · kind A · utility

10Cited by
3References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 3, 1992
Grant dateNov 9, 1993
Priority date
Expiry dateSep 3, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L77/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Flameproofed thermoplastic molding materials comprises PA0 A) from 5 to 93.5% by weight of a thermoplastic polyamide, PA0 B) from 5 to 85% by weight of a polyphenylene ether, of which up to 40% by weight, based on B), may be replaced by an aromatic vinyl polymer, PA0 C) from 0.5 to 20% by weight of red or black phosphorus, PA0 D) from 1 to 20% by weight of a block copolymer which has a Shore A hardness>80 and has been formed from a conjugated diene and an aromatic vinyl compound, PA0 E) from 0 to 15% by weight of an impact modifying polymer other than D), PA0 F) from 0 to 45% by weight of a fibrous or particulate filler or a mixture of a fibrous with a particulate filler, PA0 G) from 0 to 20% by weight of customary additives in effective amounts, the percentages A) to G) adding up to 100%.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.