Multilayer circuit board for mounting ICs and method of manufacturing the same
US5260518A · kind A · utility
59Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1991 |
| Grant date | Nov 9, 1993 |
| Priority date | — |
| Expiry date | Dec 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board on which integrated circuit chips may be directly mounted has holes at predetermined locations, electrical connections between a chip and conductive layers of the circuit board being accomplished via the holes. The electrical connections are in the form of bump members which protrude outwardly from the circuit board. The bump members cooperate with an electrically conductive plating layer or filler that is in intimate contact with a conductive layer(s) exposed in the formation of each hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.