Routing structure for a customizable integrated circuit
US5260597A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1991 |
| Grant date | Nov 9, 1993 |
| Priority date | — |
| Expiry date | Jan 7, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A selectably customizable semiconductor device including a first metal layer disposed in a first plane and including first elongate strips extending parallel to a first axis, a second metal layer disposed in a second plane generally parallel to and electrically insulated from said first plane and including second elongate strips extending parallel to a second axis, the second axis being generally perpendicular to the first axis, whereby a multiplicity of elongate strip overlap locations are defined at which the elongate strips of the first and second metal layers overlap in electrical insulating relationship; PA0 the second metal layer comprising a plurality of fusible conductive bridges joining adjacent pairs of the second elongate strips, each of the fusible conductive bridges including first and second fusible links; PA0 a via being defined between the first and second metal layers at a location along each of the fusible conductive strips intermediate the first and second fusible links; PA0 the fusible conductive bridges joining the adjacent pairs of the second elongate strips overlying alternating first elongate strips and being arranged in a staggered arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.