Logic module assembly for confining and directing the flow of cooling fluid
US5260850A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1991 |
| Grant date | Nov 9, 1993 |
| Priority date | — |
| Expiry date | Dec 24, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An improved logic module comprises integrated circuit chips located in channels. The channels convey a flow of a cooling fluid or a combination of cooling fluids, bringing the cooling fluid into contact with the integrated circuit chips. Flow blockers and power blades form boundaries of the channels and substantially exclude the undesirable entry or exit of cooling fluids at the boundaries. A support frame holds the logic modules of a cluster of logic modules in a generally parallel relationship. Sealing plates between logic modules and an assembly gasket substantially prevent flow short circuiting. The power blades mate sealably with a horizontal buss to conduct electric power to the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.