Method of cleaning semiconductor wafers using mixer containing a bundle of gas permeable hollow yarns
US5261966A · kind A · utility
17Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1992 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Jan 24, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
For cleaning semiconductor wafers in a cleaning vessel by supplying a cleaning fluid through a supply line thereto, a mixer is provided. Deionized water is supplied to the mixer through a deionized water supply line, and a cleaning gas is supplied thereto from a gas reservoir to produce the cleaning fluid. After treating the semiconductor wafers with the cleaning fluid, the deionized water is supplied to the cleaning vessel to rinse them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.