Additive plating process
US5262041A · kind A · utility
22Cited by
3References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 11, 1992 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Dec 11, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.