Photosensitive resin composition and photosensitive element using the same
US5262277A · kind A · utility
8Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1992 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Jan 22, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0757
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.