Method for packaging a semiconductor device
US5262355A · kind A · utility
17Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1993 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Mar 15, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention is directed to a method for packaging a semiconductor flip chip on a substrate by face-down bonding in which coherent light is used to irradiate a bonding head and the substrate, and the light reflected by the bonding head and the substrate form interference patterns. Adjustment of the inclination of the bonding head against the substrate is performed by observation of the interference fringes caused by the interference between the light reflected by the bonding head and the light reflected by the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.