Silicone modified polyimide resin and method for preparing same
US5262505A · kind A · utility
43Cited by
4References
6Claims
0Family size
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Key dates
| Filing date | Jul 22, 1992 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Jul 22, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/106
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide resin is prepared by reaction of a tetracarboxylic dianhydride with a specified class of amino functional organosilicon compounds followed by cycloimidization of the resultant polyamide acid intermediate. The resin is characterized by an excellent adhesion to various types of inorganic substrates such as glass. The present method employs relatively low temperatures for the cycloimidization reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.